Produktinformationen "3D Stacked Chips"
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
| ISBN: | 9783319793054 |
|---|---|
| Verlag: | Springer International Publishing |
| Auflage: | 1 |
| Sprache: | Englisch |
| Seitenzahl: | 339 |
| Produktart: | Kartoniert / Broschiert |
| Herausgeber: | Elfadel, Ibrahim (Abe) M. Fettweis, Gerhard |
| Erscheinungsdatum: | 26.05.2018 |
| Verlag: | Springer International Publishing |
| Untertitel: | From Emerging Processes to Heterogeneous Systems |
| Schlagworte: | 3D Heterogeneous Integration 3D Integrated Circuits 3D Optoelectronic Integration 3D Process Development TSV Modeling and Circuit Techniques Thermal Management of 3D ICs Three-dimensional Integrated Circuit Design |
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