Produktinformationen "Carbon Nanotubes for Interconnects"
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
| ISBN: | 9783319297446 |
|---|---|
| Verlag: | Springer International Publishing |
| Auflage: | 1 |
| Sprache: | Englisch |
| Seitenzahl: | 333 |
| Produktart: | Gebunden |
| Herausgeber: | Dijon, Jean Maffucci, Antonio Todri-Sanial, Aida |
| Erscheinungsdatum: | 18.07.2016 |
| Verlag: | Springer International Publishing |
| Untertitel: | Process, Design and Applications |
| Schlagworte: | 3D Integrated Circuits Carbon Nanotubes Carbon Nanotubes and Nanostructures Graphene Graphene Nanoribbon Interconnects On-chip Interconnect TSVs for 3D Integrated Circuits |
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